3

New VLSI Multilevel Metallization Technology Using Polyimide Insulation

Year:
2002
Language:
english
File:
PDF, 63 KB
english, 2002
5

Adhesion of polyimide films to microelectronic article components

Year:
2006
Language:
english
File:
PDF, 114 KB
english, 2006
8

Effect of a magnetic field on the rate of etching of silicon dioxide in a CF4+ O2plasma

Year:
2009
Language:
english
File:
PDF, 244 KB
english, 2009